Ebook Introduction to Semiconductor Manufacturing Technology (SPIE Press Monograph PM220)By Hong Xiao
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Introduction to Semiconductor Manufacturing Technology (SPIE Press Monograph PM220)By Hong Xiao
Ebook Introduction to Semiconductor Manufacturing Technology (SPIE Press Monograph PM220)By Hong Xiao
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IC chip manufacturing processes, such as photolithography, etch, CVD, PVD, CMP, ion implantation, RTP, inspection, and metrology, are complex methods that draw upon many disciplines. Introduction to Semiconductor Manufacturing Technologies, Second Edition thoroughly describes the complicated processes with minimal mathematics, chemistry, and physics; it covers advanced concepts while keeping the contents accessible to readers without advanced degrees. Designed as a textbook for college students, this book provides a realistic picture of the semiconductor industry and an in-depth discussion of IC chip fabrication technology. The text focuses on current fabrication technologies, but older technologies are discussed for historical context.
- Sales Rank: #1969546 in Books
- Published on: 2012-10-12
- Original language: English
- Number of items: 1
- Dimensions: 10.50" h x 7.50" w x 1.75" l, 3.40 pounds
- Binding: Hardcover
- 704 pages
About the Author
Dr. Hong Xiao is a principal engineer of KLA-Tencor Corp. Previously, he was a technical marketing specialist at Hermes-Microvision, Inc. and a technical manager at Hermes Epitek. Other past positions include a working as a consultant of semiconductor process technology, a senior process engineer at Motorola Semiconductor Production Sector, and an associate professor at Austin Community College. After receiving his Ph.D., Dr. Xiao worked at Applied Materials as a senior technical instructor with expertise in dielectric thin-film deposition, semiconductor process integration, and plasma physics. Dr. Xiao has authored and co-authored over 30 journal and conference papers. He is the author of Introduction to Semiconductor Manufacturing Technology, published by Prentice Hall in 2000. He has six US patents and more than ten patents in the application process. He has been a member of SPIE since 2005.
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